Products

EF Series High Temperature Strain Gauges

The EF series is a polyimide backing strain gauges for high temperature use. The gauge has a miniature grid pattern required as strain gauge to measure the mechanical properties of printed circuit boards and mounting parts which are getting smaller.

Applicable specimen
Metal
Materials
Backing
Polyimide-Amide
Operational temperature(°C)
EFLK/EFLX:
-196~+300°C
EFCA/EFRA:
-196~+200°C
Element
Ni-Cr
Temperature compensation range(°C)
EFLK/EFLX:
+10~+150°C
EFCA/EFRA:
0~+150°C
Strain limit
1%
Bonding adhesive
CN,EB-2,NP-50
Fatigue life at room temperature
1×106
(±1500×10-6strain)

COMPOSITE MATERIALS USE

Single-element (G.F. 2.1 approx.)

Gauge pattern Type Gauge
length
(mm)
Gauge
width
(mm)
Backing
length
(mm)
Backing
width
(mm)
Resistance
(Ω)

EFLK-02-11
EFLK-02

EFLK-02-11 0.2 0.8 1.6 1.2 120
EFLX-02-11
EFLX-02
EFLX-02-11 0.2 0.8 1.8 1.2 120
EFRA-05-11
EFRA-05
EFCA-05-11 0.5 0.4 ø3.8 120
EFRA-05-11 0.5 0.4 ø3.8 120
Each package contains 10 gauges.

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